WP4: “Package Engineering”
| Work-Package Leader |
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Alan BROWN QinetiQ Ltd Malvern Technology Centre St. Andrews Road WR14 3PS, Malvern, UK Phone: +44 (0) 1684 894669 Fax: +44 (0) 1684 895113 E-mail: agbrown@taz.QinetiQ.com |
| Enquiries Desk |
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E-mail: patent-dfmm@QinetiQ.com
Phone: +44 (0) 1684 896262 |
| Work-Package Summary |
| The Package Engineering Task Force aims to link the physical domains of
micro nano structure design and package design in terms of engineering
issues, such as Failure Mode and Effect Analysis (FMEA), procedures for
reducing impact of stress and environment, and stress and assembly process
monitors. Methods of low-cost testing for integrity utilising in-systems
functions together with methods of modelling a package-environment-device
interaction need to be taken into account.
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