WP4: “Package Engineering”

SERVICES

Consultancy on all aspects of package engineering Following an initial period of "partner integration" the Package Engineering work package will evolve to offer a consultancy/ brokerage service and acts as a one stop shop for access to all aspects of packaging DfM from small research projects to volume packaging requirements. This will include packaging reliability and failure analysis, test structures for packaging and package design, and modelling and simulation of the device package interaction, in association with the other PATENT work packages. After August 2005 the services will be promoted/ marketed externally. Initial offering will include: "Database for materials, techniques, test structures and failure modes for micro- and nano-system devices and packaging" Package Engineering technical work package partners will work with partners from the WP3 Reliability and Charactersiation Engineering technical work package to collect and collate information on the current status of micro- and nanosystems package engineering across the full range of application areas, inertial, environmental, RF, MOEMS, microfluidics and bioMEMS. The resultant information will be collected in a series of integrated, interlinked databases covering materials, techniques, test structures and failure modes for micro- and nanosystem devices and packaging. These databases will be made available on a commercial basis early in 2006. Report on "the status of micro- and nanosystem packaging" Package Engineering work package partners will collect and collate information on the current status of micro- and nanosystems package engineering across the full range of application areas, inertial, environmental, RF, MOEMS, microfluidics and bioMEMS. A summary report will be prepared entitled " The status of Micro- and Nano-System Package Engineering". For each application area the report will summarise current packaging solutions/ techniques. Details will also be given of packaging related failure modes, and appropriate test structures for in package monitoring (both during the design phase and throughout the lifetime of the system). Relevant issues relating to materials for packaging will also be discussed. The report will be sold in association the PATENT-DfMM WP6 Dissemination and Networking. The Package Engineering work package will maintain a technology watch activity to ensure that the document is continually updated. Briefing document "Key challenges for packaging engineering as device dimensions approach the nanoscale" Package Engineering work package partners will prepare and publish a review/ briefing document outlining key issues for packaging engineering as device dimensions approach the nanoscale, and considering issues related to interfacing nanoscale device to the macro world. Summary presentations resulting from the activity will be presented at appropriate events, but the full detailed briefing document will be sold in association the PATENT-DfMM WP6 Dissemination and Networking. The Package Engineering work package will maintain a technology watch activity to ensure that the document is continually updated. Laser based processes for MEMS assembly and packaging In recent years laser based processes have been widely used in materials processing and manufacturing (marking, cutting, welding, drilling and cleaning etc). For example laser technology has made a significant impact on advanced electronics manufacture in producing circuit boards (drilling micro-vias) and fine pitch stencils for printing interconnection materials for flip chip assembly. There is no doubt that laser technology will make a similar impact on manufacture of MEMS products. Laser micromachining and laser assisted etching processes have been developed and used for fabrication of MEMS structures/devices. Recently localised laser heating/bonding process has been investigated for wafer to wafer bonding with potential application in wafer level packaging of MEMS devices. Package Engineering work package partners, Heriot Watt University, IMEC and Lancaster University will develop laser based processes for micro- and nanosystem packaging applications. This work will be of particular value to industry in the many situations where temperature excursions incurred during the packaging process can have a deleterious impact on device performance. Report on "Chip on Board techniques for micro- and nanosystem packaging Chip-On-Board (COB) - assembly of electronic bare die components directly onto substrates - has been of great interest to the research and manufacturing communities these recent years. Several manufacturing techniques and materials have been developed to increase the reliability of COB whilst keeping manufacturing cost low. Package Engineering work package partners will work towards adapting electronic device COB techniques and materials for the direct assembly of MEMS components onto electronic substrates. This will result in a reduction of the packaging hierarchy, fewer interconnects smaller modules and cheaper manufacturing. Correct selection of packaging materials will also lead to improved efficiency - (both mechanically and electrically), and higher reliability of the overall system. The activity will result in the preparation and publication of a summary report on applicable techniques, and a commercial consultancy/ service offering. Methodology and initial tool-set for the assessment of the impact on packaging on the performance and reliability of MEMS devices Packaging of components based on microsystems technology represents a significant part of the cost of any given component. It should also be noted that packaging is also often the least developed aspect of technology used to realise the system, often resulting in a deleterious impact on device performance and giving rise to the main causes of long-term component failure. These problems both slow the development of these devices and their introduction into the market place. Package Engineering work package partners will work with partners from all of the other technical work packages to contribute to the development of a methodology to assess the impact of packaging on both the performance and reliability of MEMS devices both during the design phase and during its operational lifetime. This will be achieved through a combination of improved modelling and simulation of the device package interaction, and the use of specifically designed test structures allowing assessment and rapid measurement of key parameters related to the package environment such as stress and pressure. The collaboration of PATENT-DfMM Network of Excellence partners across all of the technical work packages will provide the required test, modelling, characterisation and packaging skills to ensure the timely delivery of the overall aim of the programme Although example sensor packaging problems will be chosen to act as vehicles for this particular exercise, once a successful methodology is established, it could be transferred to different devices, technologies, or packaging techniques. The availability of such a methodology to the wider European Community will put the Community in a strong position with respect of the commercialisation of world-class micro- and nano-devices into real products and applications. Test structures developed within this activity may be used to predict future failure of micro and nanosystem components, by monitoring key parameters throughout the component lifetime. Test structures could be integrated along with components to be packaged, or simply added to the package. Such a capability could be of real interest in high reliability or safety critical applications.