WP4: “Package Engineering”

RESEARCH PROJECTS

Investigation of Laser Based Processes for MEMS Assembly and Packaging, Heriot Watt (lead), IMEC & Lancaster University MOEMS Packaging in Harsh environment CSL (lead), BUTE Methodology to assess impact of packaging on MEMS components Cross work package activity involving all of the technical work packages, WP4 partners involved QinetiQ (lead), Tyndall Institute (formerly NMRC), IMEC, Fraunhofer IZM Berlin, Heriot Watt FEA and modelling of IMS (insulated metal substrate) packaging structures using ANSYS University of Lancaster (lead), Fraunhofer IZM Berlin Identification of Assembly Solutions for Low Cost Packaging of MEMS Components by Assembly of Bare Microsystem Dice Directly onto Substrates University of Lancaster (lead), Heriot Watt University, BUTE, QinetiQ, Fraunhofer IMS Dresden