WP3: “Reliability & Characterisation”

RESEARCH PROJECTS

MEMS test structures for material, process and reliability characterization Partners: IMT, HWU, IEF, QinetiQ, IMS, POLIMI, WUT, BUTE, CEA-LETI, LAAS Reliability of M(O)EMS in harsh conditions Partners: FhG IMS, CSL, BUTE, IXL, FhG IZMM, IMT, IEF Reliability of MEMS basic moveable structures Partners: IMT, IMEC, IEF, NMRC, IMS, LAAS, POLIMI, WUT, BUTE Methodology and high level design of failure modes of MEMS Partners: HWU, IMEC, ISLI, LAAS Properties of materials used in microsystems Partners: IEF, BUTE, CSL, Fr. IZM, Fr. IZM-M, Fr. IMS, IMEC, IMT, IXL, LAAS, LETI, POLIMI, WUT Methodology to assess impact of packaging on MEMS components Partners: QinetiQ, ULANC, NMRC, FhG-IZM, POLIMI, HWU Failure mode database Partners: HWU