WP4: “Package Engineering”

PUBLICATIONS

"Thermal issues in stacked die packages" M. Rencz Accepted to be published in the Proceedings of the XXIth SEMI-THERM Symposium, March 14-17, 2005, San Jose, CA, USA. "Thermal characterisation of a radial microchannel cooling plate" Gy, Bognár, Gy. Horváth, Zs. Kohári, V. Székely, A. J. Pang, M. Desmulliez, M. Rencz Accepted to be published in the Proceedings of the XXIth SEMI-THERM Symposium, March 14-17, 2005, San Jose, CA, USA. "Design, manufacture and testing of a low-cost micro-channel cooling device" A. J. Pang, M.P.Y. Desmulliez, M. Leonard, R.S. Dhariwal, R.L. Reuben, A.S. Holmes, G. Hong, K.R. Pullen, F. Waldron, O. Slattery, M. Rencz, D.R. Emerson, R.W. Barber Design, manufacture and testing of a low-cost micro-channel cooling device. Accepted to EPTC 2004, 6th Electronics Packaging Technology Conference, 8-10. December, 2004, Singapore "Thermal Qualification of 3D Stacked Die Packages" M. Rencz, G. Farkas, V. Székely, A. Poppe, B. Courtois EPTC 2004, 6th Electronics Packaging Technology Conference, 8-10. December, 2004, Singapore ORAL PRESENTATIONS "Dft Strategies, Packaging and Environment" Andrew Richardson (Lancaster University) PATENT-DfMM MEMS summer school in Livingston 13th to 15th September "Package Engineering" Reuben Cutajar (Lancaster University) PATENT-DfMM MEMS summer school in Livingston 13th to 15th September "Flip Chip Technology for MEMS Assembly and Packaging" Changhai Wang (Heriot Watt University) PATENT-DfMM MEMS summer school in Livingston 13th to 15th September