WP3: “Reliability & Characterisation”

PUBLICATIONS

"Modelling, manufacture and test of a microchannel cooling plate for microelectronics packaging" A. J. Pang, M.P.Y. Desmulliez, M. Leonard, R.S. Dhariwal, R.L. Reuben, A.S. Holmes, G. Hong, K.R. Pullen, F. Waldron, O. Slattery, M. Rencz, D.R. Emerson, R.W. Barber. 6th International Conference on Electronic Materials & Packaging (EMAP) December 2004 Penang, Malaysia "Complex analysis of MEMS surfaces by AFM" S.A.Chizhik, Z.Rymuza invited plenary key-report presented during the 5th International Conference "Mechatronics 2004", September 23-25, 2004, Warsaw, Poland, not already published "Ultrathin Films - A Way to Solve Tribological Problems in Microdevices" Z.Rymuza invited, plenary talk given during China International Symposium on Tribology CIST`2004, November 8-11, 2004, Xian, China, published in : Proceeedings of the 4th China International Symposium on Tribology CIST`2004, November 8-11, 2004, Xian, China, pp.21-27 "Characterisation of mems movable structure materials by stylus method" G. Perlaky, Z Szucs 8th IEEE Workshop on DDECS 14-15 April 2005, Sopron "Requirements on reliable MEMS packaging for harsh Environment" Z, Szucs, B Németh IEEE Workshop on DDECS 14-15 April 2005, Sopron "Rupture tests on polysilicon films through on-chip electrostatic actuation" Cacchione, F., De Masi, B., Corigliano, A., Ferrera, M., Proceedings Eurosime04, Brussels, May, 9-12 (2004). Also submitted to Sensor Letters for special Eurosime publication "Out of plane flexural behaviour of thin polysilicon films: mechanical characterization and application of the Weibull approach" Cacchione, F., De Masi, B., Corigliano, A., Ferrera, M., To appear in: Proceedings Eurosime05, Berlin, April, 18-20 (2005) "In-plane and out-of-plane mechanical characterization of thin polysilicon" Cacchione F., De Masi B., Corigliano A., Riva C., Vinay A., To appear in: Proceedings Nanotech05 "Concurrent Engineering - A Tool for Improving MEMS Research and Manufacturing" M.Bazu Proceedings of the 24th IEEE International Conference on Microelectronics - MIEL 2004, Nis (Serbia & Montenegro), 16-19 May 2004, pp.41-48. "Modern techniques for analysing sensor failure: state-of-the-art in Romania" M.Bazu, C.Tibeica, L.Galateanu, V.Ilian, Proceedings of the 9th International Conference on Quality and Dependability, Sinaia (Romania), 29 Sept-1Oct.2004, pp.95-102 "Reliability assessment by virtual prototyping of MEMS tunable Fabry-Perot optical cavity" M.Bazu, C.Tibeica, L.Galateanu, V.Ilian, Proceedings of the 27th IEEE International Semiconductor Conference - CAS 2004, Sinaia (Romania), 4-6 Oct 2004, pp.249-253. "On wafer calibration for pressure sensors" Koester, Oliver Sensor 2003. 11th International Conference. Proceedings. Vol.1, Wunstorf : AMA Service GmbH, 2003, p.233-238 "Modeling of water vapour permeation inside BCB-sealed packages for Microsystems" D.Veyrié, M. Budinger, A. Tetelin, J.L. Roux, F. Pressecq, C.Pellet Abstract accepted for DTP 2005