- As the package often affect the performance of a MNS and as the package often provide a way to connect the system to the external world, it is generally necessary to test packaged devices. Numerous bad devices are then packaged to be rejected after.
- Our research aims to provide test methodologies that use package models or PCM test structures to reject dies before packaging.
- Structural-based testing is also considered as a solution to identify defective parts before packaging.
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