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DfMM Training Courses
12-14 December 2005 at IEF, Paris, France A working knowledge of analysis tools and techniques is essential during the development of MEMS packages. This latest PATENT-DfMM course covers a wide range of methods of interest to current MEMS designers, and aims to give an introduction to engineers and scientists who have recently started work in this field.
After an introduction to current packaging techniques and technologies, the course will focus on experimental and simulation techniques. The experienced presenters will cover the following:
Introduction to MEMS Packaging Techniques and Technology
•Examples of MEMS applications for different markets
•Difference between Electronics and MEMS packaging strategies and requirements
•Assembly/Interconnection and Encapsulation
•Examples of MEMS packaging
Analysis Techniques for MEMS Packages
•Optical techniques for films/MEMS inspection and mechanical testing before packaging
•Testing techniques for wafer bonding and wafer level packaging
•Practical training: MEMS characterization by optical profilometry-vibrometry
•Hermeticity
•Mechanical strength
•Failure analysis techniques
•Reliability testing
•Testing approaches for submicron and nanomechanical material behaviour – A brief overview
•Deformation measurements at micro and nano scale by digital image correlation techniques (includes practical training)
•Residual stress measurements
MEMS Package Simulation Techniques
•Basic mechanics
•Material behaviour and characterisation
•Failure mechanisms and life time models (Failure Mechanics, Fracture Mechanics)
•Basic package MEMS interaction
•Practical Training
Presenters
Olaf Wittler, Fraunhofer IZM, Berlin
Alain Bosseboeuf, IEF, Paris
Ingrid De Wolf, IMEC, Leuven
Andrew Richardson, ULAN, Lancaster
Changhai Wang, HWU, Edinburgh
Course Fee
900 Euros per person + VAT
Fees include tuition, student notes, lunches and light refreshments. Discounts are available for PATENT students.
Delegates must submit a registration form
( www.patent-dfmm.org/training/register.htm )
( www.patent-dfmm.org/training/register.htm )
To register please contact:
Suzanne O’Hare, Marketing Executive, ISLI.
Direct Dial: +44 (0) 1506 469 303
Direct Dial: +44 (0) 1506 469 303
FAX: +44 (0) 1506 469 301
Email: courses@sli-institute.ac.uk
Credit Card payment (VISA or MasterCard) preferred.
Course Location
Institut d'Electronique Fondamentale
Université Paris Sud, Bât.220
15, rue Georges Clémenceau
91405 ORSAY, France
Tel: +33 (1) 69 15 76 12
Accommodation
A list of hotels is provided on the IEF webpage
Please contact the hotel of your choice directly.
Notes
This is a 3 day course, although it may be possible to attend for a shorter time. In this case the fee will be 750 Euros (2 days) or 500 Euros (1 day).
A 10% administration fee is charged for cancellations made more than 2 weeks before the start of the course. Cancellations of 2 weeks or less will be liable to the loss of the full fee. Substitutions may be made at any time until the start of the course. ISLI reserves the right to cancel any course at short notice or to postpone or make necessary alterations to the content. If a course is cancelled by ISLI, course fees will be refunded in full however no liability is accepted for other expenses including changes to travel arrangements.
The course is presented in English.
Enquiries
Contact George Bell, PATENT Training Leader.
Direct Dial: +44 (0) 1506 469 310
Email: george.bell@sli-institute.ac.uk
Direct Dial: +44 (0) 1506 469 310
Email: george.bell@sli-institute.ac.uk