PATENT-DfMM participation in METRIC 2006
11-13 Sep 06, Pittsburgh, PA, USA

The MEMS Industry Group held their 6th annual METRIC conference last week in Pittsburgh, PA, USA. Over sixty members of MIG came together over two days to discuss the METRIC topic: Focus on MEMS Integration. NEXUS and the PATENT-DfMM project were represented by Prof Andrew Richardson (PATENT-DfMM co-coordinator and NEXUS SC member) and Patric Salomon (NEXUS Vice-Chair and PATENT-DfMM partner) with Andrew Richardson co-chairing one of the working groups.
Six working groups covered such topics as IC Component Level Integration, Wafer Level Encapsulation, Packaging Integration, Integration of RF Devices, and MEMS Business Decisions. The working groups then delivered a series of technical and business- related recommendations to the industry for ways to address MEMS integration issues:
These included such things as more case studies about successful integration practices, better partnerships between semiconductor and MEMS organizations, databases for materials properties, and additional industry-wide working conferences dedicated to both the business and technical side of MEMS integration. The MEMS Industry Group will now distill these recommendations and choose several to address over the next nine months – at the same time NEXUS and PATENT-DfMM will evaluate where they could collaborate.
More information: www.memsindustrygroup.org
Contact: Patric Salomon, E-Mail: patric.salomon@4m2c.com