1-4 Oct 2007, Lancaster, UK

Design for Manufacture Summit at Lancaster University, 2-4 Oct 2007

A “Big event” for “Small Systems” was the headline that appeared in the press release from UK journalists covering this event. In the context of the events diary across the globe, 84 delegates can hardly justify labelling this event as “Big” but for the delegates this was indeed a highly significant meeting as it formed the main showcase for the technical work carried out within the FP6 Network of Excellence in Design for Micro & Nano  Manufacture (PATENT-DfMM).

Patent-DfMM was set up in 2004 and aimed to bring together researchers from the areas of design, test, reliability and package engineering to create multi-disciplinary teams better able to address key manufacturing challenges in the Micro & Nano Systems space. The intention was that the enhanced capability that could be delivered by this integration process would improve the teams’ potential to attract research funding and stimulate sufficient interest from industry to justify rolling out the teams’ capability through commercial services.

This 3 day conference aimed to pull together the technical research work initiated by the PATENT-DfMM project. This included work fully supported by the project and activities stimulated by the NoE through both partial funding, feasibility projects and mobility.
The presentations delivered were clearly rich in terms of engineering research outputs associated with new concepts for embedded test and packaging technologies, reliability engineering and demonstrator focused activities. The majority of the presentations provided the audience with examples of how collaboration between conventionally isolated disciplines could deliver major benefits. Specific examples here where evident around new application focused work that have been launched by the NoE in the fields of Health and Usage Monitoring (HUMS) and Micro Electro Fluidics (MEF). In the case of  HUMS, embedded test experts, sensor engineers and packaging specialists have come together to drive forward concepts around miniaturised devices able to monitor and test higher level systems. In the case of MEF, fluidic modellers, test engineers and system-on-chip designers have collaborated to deliver concepts around chip based digital fluidics that feature active devices operating across the electronics to Biology interface.

We would like to thank the organisation team including Tina warren and Lorna Quinn from Lancaster University, Patric Salomon of 4M2C for promoting the event and the following presenters for making the event a success : Colin Lambert & Norbert Dumas (Lancaster University), Ayman El-Fatatry (BAE Systems), Marta Rencz (Budapest University of Technology & Economics), Marc Desmuliez  & Changhai Wang (Heriot Watt University), Alan Brown (QinetiQ), Chris Bailey (University of Greenwich), Patric Webb (Loughborough University), Mark Begbie (Institute for System Level Integration), Ingrid de Wolf (IMEC), Pascal Nouet (University of Montpellier), Khiem Trieu (Fraunhofer IMS), Drew Murray (CEMMNT), Attilio Frangi & Alberto Corigliano (Polytechnic Milan), Dave Emerson (STFC), Constantin Tibeica & Marius Bazu (IMT), Herve Mathias (Universite Paris- Sud), Hans Kerkhoff, (University of Twente), Martin Driesen (Katholieke Universteit Leuven), Francois Denis (Centre Spatial de Liege), Dagmar Peters & Shayam Praveen(University Bremen) & Gerold Schropfer (Coventor).

Presentations that the organisers have been given permission to distribute are available from the following table. A number of contributions from related activities, in particular the UK 3D-Mintegration (http://www.3d-Mintegration.com) and IeMRC (http://www.ieMRC.org) were integrated into the program to provide “cross-fertilisation between the NoE and these national programs.
Andrew Richardson, University of Lancaster, UK

Download of Presentations

Event poster for download: pdf
Event leaflet for download: pdf
Press Release for download: pdf

Date	Session	Title of presentation	Presenter	PDF
01/10/2007 Day 1	1	Micro & Nano Systems, market trends and growth opportunities	H Van Heeren, Enabling MNT (NL)
	1	Micro and Nano Technology facilities in the UK	Prof. H. Clare
	2	Access to silicon & polymer based technologies for MEMS and bio/fluidic Applications: the framework VI INTEGRAMplus consotium	Prof. C Pickering QinetiQ
	2	Engineering services to support design through to manufacture - The FP6 Network of Excellence cluster	Prof. A. Richardson Lancaster University
	2	Europractice - A public funded organisation providing access to software, technologies and IC services	P. Salomon 4M2C
	2	Training Services in the domain of Micro & Nano Systems	Dr. D. Koltsov Lancaster University
	3	Silicon MEMS microphone for hi-fi and industrial applications	C. Reeves QinetiQ
	3	Bio-fluidics applications	Dr T Ryan EPIGEM UK
	4	FP7 SME support initiatives (ICT and Capacities)	G. Popovic EC Project Officer
	4	NEXUS - Aeuropean association supporting the SME base	Dr. A. El-Fatatry BAE Systems
02/10/2007 Day 2	1	PATENT DfMM Actions & Priorities to March 2008	Prof. A. Richardson
	1	Guest Lecture - Systems Engineering - the foundations for multitechnology integration within the Micro & Nano Systems world	Dr. A. El-Fatatry BAE Systems
	2	Micro & Nano Systems - Market entry, business practice and supply chains - embedded tutorial	P Salomon 4M2C and Dr D. Koltsov Lancaster University
	3	Microsystems Packaging & Interconnect Roadmap	M. Desmulliez HWU & A. Longford (Pand A Europe)
	3	Collaborative study on the impact of die attach adhesives on Chip-on-Board technologies for MEMS integration	D Combes & A Brown QinetiQ, N Cordero Tyndall
	3	Package & Assembly Reliability in System-in Package Technology	C. Bailey Greenwich University
	4	New Packaging Technologies for miniturised products	P. Webb LeMRC Loughborough University
	4	Embedded Tutorial: Intelligent multi-sensor arrays for aircraft wiring systems monitoring	A Sutherland BCF Design & M Desmulliez HWU
	4	The HUMS Service Cluster	M. Begbie Systems Level Integration Ltd
	5	Embedded Seminar - MEMS Reliability Testing	I De Wolf IMEC Belgium
	5	Motionless testing of embedded inertial sensors	P. Nouet CNRS Universite Montpellier
	5	Equipment & Services Access across Europe - the PATENT-dFmm Reliability Service Cluster	K. Trieu Fraunhofer IMS
	5	Access to Characterisation Services	D. Murray CEMMNT
03/10/2007 Day 3	1	Embedded Tutorial: Integrating damping mechanisms into MEMS component models	A. Frangi POLIMI
	1	Microchanel and flow modeling for Bio/Fluidic Systems	D Emerson STFC
	1	Stiction modelling in MEMS switches	C Tibeica IMT
	2	Bias Superposition - A built-in electrical only test strategy for transducers	N Dumas ULAN
	2	Embedded monitoring of Quality Factor in microresonators	H Mathias IEF
	2	Embedded test strategies for Bio/Fluidic Microsystems	H Kerkhoff MESA
	2	MEMS testing through electro-thermal excitation	M Rencz BUTE
	3	Chip Scale & Wafer Level adhesive bonding for low temperature MEMS packaging	C Wang HWU
	3	MOEMS packaging for /harsh Environments	F. Denis CSL
	3	Laser based processes for MEMS Assembly & Packaging	C Wang HWU
	3	Biocompatible Packaging for implantable sensor systems	M Driesden KUL
	4	Approach for Yield based Design in Microsystems	S Praveen ITEM
	4	Design for manufacture Support	G Schropfer Coventor
04/10/2007 Day 4	1	Reliability of MOEMS in harsh Environments	K Trieu Fraunhofer IMS
	1	Reliability Simulation - Methodology & Support for FMEA	M Desmulliez HWU
	1	Hermeticity testing of Zero-Level Packaging	I De Wolf IMEC
	1	Quantitative Accelerated Life Testing of MEMS Tutorial	M Bazu
	2	Biodrop Flagship	H Kerkhoff MESA