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2nd Technology Roadmapping Event on Packaging of MEMS, 8 June 2006 at Fraunhofer IZM, Berlin, Germany
 8 June 2006 at Fraunhofer IZM, Berlin, Germany

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The first roadmapping PATENT-DfMM event, hosted by HWU (16 Feb 06, Edinburgh), was a great success. With more than half of the 30 participants coming from industry, technological trends, bottlenecks and investment opportunities in packaging of MOEMS and RF MEMS were collected and discussed in small working groups. The workshop was viewed as innovative and very useful by all participants and a lot of progress was made during this meeting. The transcription process into a roadmap format through the project team has begun. For more information (agenda, presentation, etc), see here

Objectives of 2nd Workshop
  • As a result of the first workshop at Heriot-Watt University, a list of Packaging "High-Level Challenges and Related Issues" was produced (see appendix 1). During the day, the participants will work on 4 of these High-Level Challenges. They will:
    • Prioritise these related issues, and
    • Identify key developments / R&D projects to address them

    Following a questionnaire exercise, it was decided that the 4 High-Level Challenges that will be tackled are:

    • Low-cost Wafer Level Packaging and related testing techniques
    • Improvements in CAD/Modelling
    • Hermetic/vacuum packaging and low-cost alternatives (near hermetic, plastic packages…)
    • Improved reliability
  • This will enable the selection of packaging investment opportunities, not just for the short term needs of Patent-DfMM, but also for industrialists and academics in the long term. Topics that will be identified as “highly relevant and strategic” for European industry will also be brought into the relevant EC consultation efforts and stakeholder activities such as NEXUS.
  • The workshop will therefore contribute towards industrial take-up of MEMS, the enhancement of Patent-DfMM capabilities, and future EC strategies.

 

What you will gain out of the day
  • Advanced knowledge of the latest packaging trends in MEMS
  • An opportunity to network with academics and industrialists active in MEMS packaging
  • The final roadmap report
  • A chance to influence decision makers in MEMS and the EC through the Patent-DfMM Network of Excellence


To register for the event or for any other information please email:
Fabien Holler : f.holler@hw.ac.uk