Download agenda and invitation (PDF)

Download main presentation (PDF)

Technology Roadmapping event for Packaging of MOEMS and RF MEMS
16 Feb 2006 at HWU

The first roadmapping PATENT-DfMM event, hosted by HWU (16 Feb 06, Edinburgh), was a great success. With more than half of the 30 participants coming from industry, technological trends, bottlenecks and investment opportunities in packaging of MOEMS and RF MEMS were collected and discussed in small working groups. The workshop was viewed as innovative and very useful by all participants and a lot of progress was made during this meeting. The transcription process into a roadmap format through the project team has begun. The main presentation is available here. Further reports will be published later.

A second Meeting will take place on 8 June 2006 at Fraunhofer IZM, Berlin, German

Workshop objectives
* Producing a document identifying present and future development trends in packaging of MOEMS and RF MEMS and presenting them in a clear and diagrammatic format. This identification has already started and will continue until the workshop on February 16, 2006. During the workshop, experts will discuss, expand and organise the list. The analysis will continue after the workshop until delivery of the roadmap,
* Applying technology roadmapping and technology viability analysis techniques with a view to short select packaging investment opportunities in function of industrial needs and the Network’s objectives and capability,
* Constituting the first step towards developing a full roadmap of packaging of MEMS. Another event will take place later in the year at Fraunhofer IZM in Berlin to complete the field of packaging of MEMS,
* Contributing towards solving packaging issues, thereby fostering industrial take up of MEMS,
* Enhancing Patent-DfMM capability and services offer to industry.

What you will gain out of the day
* Advanced knowledge of the latest packaging trends in MOEMS and RF MEMS
* An opportunity to network with EU academics and industrialists
* The roadmap report resulting from this workshop
* A chance to influence decision makers in MEMS through the resulting roadmap
* The opportunity to continue collaboration with the Patent-DfMM Network of Excellence within projects to be defined as a result of the roadmapping exercise.

Participants are invited:
* All Patent-DfMM members with expertise in packaging.
This includes primarily Work Package 4 (Packaging) partners as well as other members who are willing to contribute actively to the workshop,
* All members of the Patent-DfMM Industrial Advisory Board (IAB).
* Members of AMICOM (www.amicom.info) an EU FP6 Network of Excellence in RF MEMS, and
* Selected industrialists and researcher who are willing to share their knowledge on packaging needs.

A draft agenda for the day can be found here
To register for the event or for any other information please email:
Fabien Holler,f.holler@hw.ac.uk