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Workshop on “Design for Micro & Nano Manufacture” in conjunction with DTIP

Organised by the EC-funded Network of Excellence "Design for Micro & Nano Manufacture" (PATENT-DfMM). The network was launched in 2004 and aims to establish a collaborative team to provide European industry with support in the field of "Design for Micro and Nano Manufacture (DfMM)" to ensure that problems affecting the manufacturing and reliability of products based on micro nano technologies (MNT) can be addressed before prototyping and production.
More information : http://www.patent-dfmm.org

PATENT-DfMM is an initiative that builds on industrial needs, which have been defined by key commercial players and studied by the NEXUS "Design Modelling Simulation" workshops. PATENT-DfMM co-operates worldwide to coordinate research and services in DfMM. The network is supported by an educational programme addressing DfMM topics in industry and academia. This combines training courses and educational initiatives that already exist for DfMM, but also develops new ones that are needed to lower the barriers to commercialisation for the next generation of MNT based products.

Objective of this workshop

This workshop will present European research activities in the areas of MEMS Testing and Packaging, discuss PATENT-DfMM objectives, and aims at getting feedback on industry needs in the Design for Micro and Nano Manufacture. It also includes two tutorials on topics that have been identified as being crucial for the MEMS industry, held by European experts:

Techniques for Failure Analysis of MEMS and MEMS Packages (IMEC)
Thermal Characterisation of MEMS Structures and Packages (BUTE/MicReD)

Agenda and presentations

Monday 30 May

14:00 – 15:30	Workshop on “Latest Advances in MEMS Testing”, WP1
	Session organised by P. Nouet (E-Mail: nouet@lirmm.fr ), LIRMM, France

		Welcome address and WP1 activity overview, Pascal Nouet, WP1 leader
		DfT for Biosensors , Hongyuan Liu, University of Lancaster
		Bias superposition for MEMS Testing , Frederick Mailly, LIRMM, Univ. of Montpellier II
		On-chip testing for mechanical characterization of thin polysilicon films , Alberto Corigliano, Politecnico di Milano

15:50 – 17:20	Tutorial “Techniques for Failure Analysis of MEMS and MEMS Packages”
	I. De Wolf (E-Mail: ingrid.dewolf@imec.be), IMEC, Belgium

Tuesday 31 May

09:00 – 10:30	Tutorial “Thermal Characterisation of MEMS Structures and Packages”
	M. Rencz (E-Mail: rencz@eet.bme.hu), BUTE/MicReD, Hungary

10:50 – 12:20	European Research Programmes in MEMS Packaging / Package Engineering
	Session organised by A. Brown (E-Mail: agbrown@QinetiQ.com), QinetiQ , UK

		Introduction to PATENT-DfMM Package Engineering activities
		Guest Presentation: Rapid prototyping and packaging of microsensors for niche products - Peter Friis, DELTA
		Investigation of Laser Based Processes for MEMS Assembly and Packaging – Changhai Wang - Heriot Watt University
		MOEMS Packaging for Harsh environments – Jerome Loicq, CSL
		To develop a methodology and initial tool-set for the assessment of the impact of packaging on MEMS devices – Alan Brown, QinetiQ

14:00	NEXUS MWG-DMS and NoE PATENT-DfMM Workshop “Design Modelling Simulation (DMS) of Microsystems” This workshop is co-organised by the NEXUS Methodology Working Group "Design Modelling Simulation" (MWG-DMS), formerly USC-CAD, and the EC-funded Network of Excellence "Design for Micro & Nano Manufacture" (PATENT-DfMM). Its objective is to share latest developments and ideas for “Design for Manufacture” methodologies and their potential implementation into algorithms and design tools.

14:00 – 15:30	Session 1: DMS Methodologies towards a "Design for Micro Nano Manufacture Approach"
	Chaired by P. Salomon (E-Mail: patric.salomon@4m2c.com), 4M2C, Berlin , Germany

		Overview on the NoE PATENT-DfMM , Andrew Richardson, Lancaster University , UK
		NoE PATENT-DfMM: Methodology Development and Interface to Users , Nicolas Cordero, Tyndall Ireland
		New Development for mor4ansys: Parametric and Nonlinear Model Reduction, E. B. Rudnyi, J. G. Korvink, IMTEK, Freiburg , Germany
		Co-simulation of autonomous microsystems , Karine Matou, TIMA, Grenoble , France
		Overview on the PROMENADE project (Process management and design system for microsystem technologies), Rainer Brück, Kai Hahn, University of Siegen , Germany

15:50 – 17:20	Session 2 (joint session with the AMICOM workshop): DMS Tools for RF MEMS and DfMM
	Co-chaired by Larissa Vietzorreck, TU Munich and Patric Salomon, 4M2C, Berlin

		NoE PATENT-DfMM: Interface to Tools and EDA Providers , Raluca Muller, IMT Bucharest , Romania
		Recent DfMM Developments in CoventorWare , Gerold Schröpfer, Coventor, France
		SoftMEMS Approach to DfMM , Ridha Hamza, Mary Ann Maher, SoftMEMS , France / USA
		EM modeling with MAGMAS 3D, Yves Schols, K.U.Leuven , Belgium
		Hybrid electromagnetic/acoustic analysis of TFBAR devices and circuits, Marco Farina, Università Ancona , Italy
		Efficient RF Mems design using 3D Finite Difference Time Domain electromagnetic simulations, W. Simon, IMST GmbH, Germany

17:20 – 17:50	Discussion of future needs and wrap-up

Wednesday 1 June

	Panel on DESIGN FOR MICRO & NANO MANUFACTURE AND PACKAGING within DTIP
	Moderator: P. Salomon, 4M2C PATRIC SALOMON, Berlin , Germany

		A. Richardson, U. Lancaster , UK
		K. Persson, IMEGO, Sweden
		F. Rudolf, Colibrys S.A. , Switzerland
		J. Deacon, PERA , UK

The Venue

Hôtel Eden au Lac, Montreux, Switzerland

Registration fee

€150 (including coffee breaks, lunch on 31 May and proceedings)
Please register for this 1.5 day Workshop on Design for Micro & Nano Manufacture through the DTIP registration form at http://tima.imag.fr/conferences/dtip/DTIP2005/. Hotel information is also available from the DTIP website.

The detailed programme of the workshop will be updated at: http://www.patent-dfmm.org. For additional information or if you are interested in presenting within this workshop, please contact: Patric Salomon, 4M2C PATRIC SALOMON GmbH, Germany, E-mail: patric.salomon@4m2c.com.

DTIP (1-3 June)

DTIP is the symposium on Design, Test, Integration and Packaging of MEMS and MOEMS. The goal of DTIP is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modelling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. Within the DTIP Programme on 1 June, there will also be a PANEL on "Design for Micro & Nano Manufacture - Industry Needs and Research Status" to present and discuss key results from this workshop.
http://tima.imag.fr/conferences/dtip/DTIP2005/.