Workshop on Reliability & DfX Engineering for System-in-Package Technologies In Conjunction with European Test Symposium 2008
Grand Hotel Majestic, Pallanza, Lago Maggiore, Italy
Thursday, May 29th, 2008


The SiPeX workshop aims to bring together reliability and test engineers to discuss advanced design methodologies, integration technology and assembly engineering for SiP solutions that embrace heterogeneity, multiple energy domains and mixed technology platforms.

Sponsors

- Patent-DfMM, the FP6 Network of Excellence in Design for Micro & Nano Manufacture
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- ieMRC, the UK Innovative Electronics Manufacturing Centre
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- INTEGRAMplus, FP6 Integrated Project "Integrated Micro & Nanotechnology Platforms and Services"
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Program

8h00

Registration

8h30-8h45 Welcome Address
Andrew Richardson, University Lancaster
   
  Session 1 - Overview of integration technologies       
8h45-9h15  Reliability & Test Challenges around  C2W and W2W SiP assemblies
Norman Marenco, Fraunhofer ISIT
9h15-9h45  Reliability studies around the PICS, System-in-Package Technology
A Richardson, Lancaster University
9h45-10h15

Reliability and Test Challenges in Bio-SiP
Hans Kerkhoff, University of Twente

10h15-10h30 Discussion on Generic Challenges for the Test and Reliability Community
10h30-11h00 Coffee
   
  Session 2 - Design for test, Design for Reliability 
11h-11h30 Evaluation of mixed-signal/RF DFT solutions for SiP devices using statistical techniques
Salvador Mir, TIMA / INPG
11h30-12h Reliability and Test Challenges in Multi-Technology SiP platforms within the INTEGRAMplus service
Chris Reeves, QinetiQ
12h-12h30    On-Line Testing of Ohmic RF MEMS Switches for SiP applications
J
ari Hannu, Markus Ängeslevä and Markku Moilanen University of Oulu, Finland
   
 

Session 3 – Reliability and Test

14h-14h30 Reliability and Test Challenges of NoC on 3D SiP platforms
Dr. Li-Rong Zheng, KTH, Sweden
14h30-15h Embedded Test Challenges around SiP technologies
Prof. Pascal Nouet LIRMM / University Montpellier II
15h-15h30 Modelling Methodologies for Reliability and Prognostics of SiP Structures – Current Capabilities and Future Challenges
Chris Bailey and Stoyan Stoyanov, Univ. Greenwich
15h30-16h Coffee & Posters
16h30 Open discussion on new initiatives and conclusions
Andrew Richardson, University Lancaster


Workshop Chair
Prof. Andrew Richardson
Lancaster University
Lancaster,  LA1 4YR, UK
Tel.: +44 1524 593018
Fax: +44 1524 592777

Workshop Co-Chair
Prof.  Pascal Nouet
University Montpellier II - LIRMM / CNRS
Montpellier, France
Tel.: +33 467 418 527
Fax: +33 467 418 500