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Workshop on Design for Reliability and Manufacturability
in MNT
24 April 2007 (9:00-17:30), Stresa, Italy (in conjunction
with DTIP, 25-27 April)
Co-organised by the EC-funded Network of Excellence "Design for Micro
& Nano Manufacture" (PATENT-DfMM) and the NEXUS Methodology Working Groups
"Reliability & Test" and "Design Modelling Simulation". PATENT-DfMM was
launched in 2004 and aims to establish a collaborative team to provide
European industry with support in the field of "Design for Micro and Nano
Manufacture (DfMM)" to ensure that problems affecting the manufacturing
and reliability of products based on micro nano technologies (MNT) can
be addressed before prototyping and production. PATENT-DfMM co-operates
worldwide to coordinate research and services in DfMM related topics.
Presentations now available for download:
| 9h15 |
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Welcome and programme presentation |
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| 9h20 |
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NEXUS Overview |
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| 9h30 |
Session 1 - Manufacturability
into the design flow |
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9h30 |
Overview on the "Design for Micro&Nano Manufacture
(PATENT-DfMM)" Project |
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9h50 |
Reliable Micro and Nano System Design Using Multi
Level Process Verification |
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10h10 |
"INTEGRAMplus" - a new Europractice Service
Project providing Development Platforms for Integrated Micro-Nano
Technologies and Products. |
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| 10h30 |
mini-panel - conclusions |
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| 10h45 |
Coffee break |
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| 11h15 |
Session 2 - Measuring the real
world, solutions and alternatives. |
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11h15 |
The future of Embedded Test within the Design for
Micro & Nano manufacture NoE |
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11h45 |
MEMS Reliability and Test Issues in Micromachine
Center Programs |
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| 12h15 |
mini-panel - conclusions |
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| 12h30 |
Lunch |
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| 14h00 |
Session 3 - Reliability assessments,
state of the art and further needs |
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14h00 |
Failure and dissipative mechanisms |
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14h20 |
Accelerated reliability testing |
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14h40 |
Design for yield |
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| 15h00 |
mini-panel - conclusions |
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| 15h15 |
Coffee break |
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| 15h45 |
Session 4 : Reliability &
Test within EC FP7 supported by NEXUSplus |
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15h45 |
Initial Calls - FP7 program - MicroNanoSystems |
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16h05 |
New Proposals in Reliability Engineering from the
PATENT-DfMM NoE |
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16h15 |
Open Microphone for new FP7 proposals in the Reliability
& Test area |
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16h35 |
Break out sessions Building new FP7 proposals)
1. Reliability Engineering
2. Embedded Test & Health Monitoring
Conclusions |
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| 17h30 |
End of workshop |
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Objective of the workshop
This workshop builds on industry experience in microsystems’
manufacturing as discussed within the MEMS Industry Group METRIC workshops
and NEXUS Methodology Working Group meetings. Main emphasis will be
on reliability and test problems, where design methodologies can lead
to significant improvements. The workshop will discuss how to leverage
the design, reliability and test communities over the coming years for
the benefit of European competitiveness; this might include the need
for new European and International collaborative initiatives. In addition,
further industry demand for advances in Design, Reliability and Test
capability will be addressed.
The Venue
Regina Palace Hotel - Stresa, Lago Maggiore, Italy
http://tima.imag.fr/conferences/dtip/DTIP2007/HotelRegistrationForm.html
Registration fee
€120 (including coffee breaks and lunch on 24 April); For registrations
after 5 April: €160.
Please register for this 1 day Workshop on Design for Micro & Nano
Manufacture through the DTIP registration form at http://tima.imag.fr/conferences/dtip/DTIP2007/Registration_Fee.pdf
Hotel and venue information is also available from http://tima.imag.fr/conferences/dtip
The detailed programme of the workshop will be updated at: http://www.patent-dfmm.org.
For additional information or if you are interested in presenting within
this workshop, please contact: Patric Salomon, 4M2C PATRIC SALOMON GmbH,
Germany, E-mail: patric.salomon@4m2c.com
DTIP (25 – 27 April)
DTIP is the symposium on Design, Test, Integration and Packaging of
MEMS and MOEMS. The goal of DTIP is to provide a forum for in-depth
investigations and interdisciplinary discussions involving design, modelling,
testing, micromachining, microfabrication, integration and packaging
of structures, devices, and systems. More information at http://tima.imag.fr/conferences/dtip
PATENT-DfMM and NEXUS are also co-organising a special session within
DTIP on “Opportunities for Cooperative R&D” (25 Apr)
and a panel discussion on “Design for Reliability and Test of
Microsystems” (26 Apr). In the panel industrial microsystems manufacturers
will present the way they deal with reliability and test issues currently
and what their main challenges are. Also results from the Workshop on
24 April will be summarised.
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