MEMS Testing through Bias Superposition
WP1, Pascal Nouet, nouet@lirmm.fr |
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DfT for Biosensor and for Biosensor Interface
WP1, Andrew Richardson, richardson@lancaster.ac.uk |
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Quality Factor Measurement and Reliability for MEMS Resonatorse
WP1, Herve Mathias, herve.mathias@ief.u-psud.fr |
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Methodology for the assessment of the impact of packaging on the performance and reliability of MEMS devices
WP1-WP4, Alan Brown
, agbrown@QinetiQ.com |
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Modelling Effects of Packaging on MEMS, WP2 & WP4, Round Robin Modelling Study, WP2 Activities
WP2-WP4, Orla Slattery- Alan Brown,
orla.slattery@tyndall.ie - agbrown@QinetiQ.com |
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To investigate and model the key trade-offs, relevant to die attach adhesives for packaging/ CoB assembly of stress sensitive devices linked to the WP2 round-robin modelling activity
WP2-WP4, Orla Slattery- Alan Brown, orla.slattery@tyndall.ie - agbrown@QinetiQ.com |
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Simulation of the stiction effect in the metal-to-metal resistive contact occurring in MEMS switches
WP2, Catalin Tibeica, catalint@imt.ro |
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Investigation of the interaction of electromagnetic waves with micro and nanostructures using the finite difference time domain method and rigorous coupled wave theory
WP2, Cristian Kusko, cristiank@imt.ro |
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Fault modelling and System Simulation of FlowFET MEF Arrays
WP2, H.G. Kerkhoff, h.g.kerkhoff@utwente.nl |
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Measurement, Modelling and Simulation of Mechanical Properties of MEMS
WP2-WP7, Conor O‘Mahony, conor.omahony@tyndall.ie |
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Mechanism of Formation of Preferential Flow Paths in Microcirculation Vessels (Microfluidic mixer)
WP2, Krzysztof Cieslicki, k.cieslicki@mchtr.pw.edu.pl |
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Simulation of damping in MEMS over the whole working-pressure range
WP2, Attilio Frangi, attilio.frangi@polimi.it |
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Methodology and high level design of failures: specific application to thermal actuator
WP2-WP3, Marc Desmulliez, m.desmulliez@hw.ac.uk |
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Properties of materials used in microsystems
WP3, Alain Bosseboeuf, alain.bosseboeuf@ief.u-psud.fr |
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Reliability of MOEMS in harsh conditions
WP3, Hoc Khiem Trieu, trieu@ims.fhg.de |
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Methodology and high level design of failure modes of MEMS
WP3, Marc Desmulliez, desmulliez@hw.ac.uk |
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MEMS test structures for material, process and reliability characterization
WP3, Marius Bazu, mbazu@imt.ro |
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Reliability of MEMS basic moveable structures
WP3, Marius Bazu, mbazu@imt.ro |
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MEMS failure modes database
WP3, Marc Desmulliez, desmulliez@hw.ac.uk |
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Packaging Databases
WP4, Alan Brown, agbrown@QinetiQ.com |
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Identification of Assembly Solutions for Low Cost Packaging of MEMS Components by Assembly of Bare Microsystem Dies Directly on Substrates
WP4, Changhai Wang, wang@hw.ac.uk |
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MOEMS packaging in harsh environment
WP4, Serge Habraken, s.habraken@ulg.ac.be |
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Investigation of Laser Based Processes for MEMS Assembly and Packaging
WP4, Changhai Wang, wang@hw.ac.uk |
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MOEMS packaging solutions - data collection
WP4, Serge Habraken, s.habraken@ulg.ac.be |
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Identification of missing simulation parameters in MEMS design
WP4, Veronika Timar Horvath, timarne@eet.bme.hu |
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Data collection/ collation on the “state of the art” in Inertial Microsystems Packaging
WP4, Alan Brown, agbrown@QinetiQ.com |
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Data collection/ collation on the “state of the art” in Microfluidic Systems Packaging
WP4, A. Wilkinson, aswilkinson@QinetiQ.com |
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Biocompatible packaging of implanted sensor systems
WP4, Robert Puers, puers@esat.kuleuven.be |
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Technology Roadmapping: Packaging of MEMS
WP4, Fabien Holler, f.holler@hw.ac.uk |
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Missing packaging material parameters - Data collection
WP4, Marta Rencz, rencz@eet.bme.hu |
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Modeling and Simulation of the stress generation involved in producing multi-layer assemblies from Controlled Expansion (CE) alloy materials
WP4-WP7, S. Taylor, s.m.taylor@lancaster.ac.uk |
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Dissemination and Communication in "Design for Micro Nano Manufacture (DfMM)"
WP6, Patric Salomon, info@4m2c.com |
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Internet-based System for On Line Access to characterization Results - SOLAR
WP7, Marius Bazu, mbazu@imt.ro |
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Scoping study for future programme to “Demonstrate a methodology for reliable, packaged of Micro and Nanosystems”
WP7, Alan Brown, agbrown@QinetiQ.com |
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