ABOUT US


The “Design for Micro & Nano Manufacture (Patent-DfMM)” Network of Excellence aims to establish a new technical community that will address the underlying engineering science to ensure that problems affecting the manufacture and reliability of products based on MNT can be addressed before prototype and pre-production.

The work will involve teams from the fields of packaging, test engineering, reliability engineering, simulation and modelling. Although the network will take an interest in all MNT fields, there will be a specific focus on MNT based products:

  • That are deployed in harsh or demanding environments,
  • Where reliability or dependability must be fully validated, or
  • Where “right first time” manufacture is critical to meet cost and time-to-market constraints.
Patent-DfMM is seeking close interaction with organisations expected to be the major beneficiaries of this new project. These include:

  • Design and Engineering Companies or business units within companies (Design Houses) through the use of Patent-DfMM methodology in their design work,
  • Design Tool (EDA) providers through the implementation of Patent-DfMM methodology into their tools,
  • Small and medium-sized companies (SMEs) through the use of Patent-DfMM methodology and services.
Patent-DfMM will work close with other projects, networks and organizations world-wide. It is linked to the NEXUS MWG Design Modelling Simulation (DMS) and will organize a range of workshops and seminars that will be open to interested parties.

Patent-DfMM will be funded by the EC for 4 years, January 2004 to December 2007. Beyond these four years, it is planned to continue the activities on a commercial basis.

Updated information about the project will be published

  • on this website,
  • in “DfMM News” within the European journal MST News and
  • within a bi-monthly E-mail newsletter.
If you are interested in this newsletter, please send an E-mail with your complete address details to DfMM-news@4m2c.com and ask to be put on the mailing list.